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At AMPMAS Sdn. Bhd. Quality is base
on the work of all staff to achieve TOTAL customer satisfaction and grow in Partnership with customer.
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Our Quality Objective is to achieve the
manufacture process reject rate below 1% and to achieve ZERO defect products to customer
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Typical Process Flow & Control Chart for
Gold/Silver Plating
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Process Flow |
Control |
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1 |
Parts receiving |
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2 |
I.Q.C |
Surface, shape & Quantity |
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3 |
Start Plating |
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4 |
Electro Cleaning |
Per application spec. |
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5 |
Counterflow rinse |
Flow rate |
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6 |
Acid Dip |
Per application spec. |
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7 |
Counterflow rinse |
Flow rate |
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8 |
Nickel Strike /
Copper Strike |
Per application spec. |
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9 |
Counterflow rinse |
Flow rate |
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10 |
Nickel Plating |
Per application spec. |
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11 |
Counterflow rinse |
Flow rate |
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12 |
Gold / Silver Strike |
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13 |
Counterflow rinse |
Flow rate |
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14 |
I.P.Q.C. |
Appearance inspection
Adhesion test |
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15 |
Gold / Silver Plating |
Per application spec. |
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16 |
Counterflow rinse |
Flow rate |
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17 |
Counterflow rinse |
Flow rate |
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18 |
Drying |
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19 |
O.C.Q.:
Visual Inspection
Adhesion Test
Porosity Test
Ductility Test
(Bending Test)
Thickness Test
Accelerated Tarnishing
Test |
As per client’s spec. |
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20 |
Packing / Delivery |
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